The structural design of the heat sink is the most important determinant of the effectiveness of the heat sink, from the point of view of the process of heat dissipation, generally divided into heat absorption, heat conduction, heat dissipation of three steps. Heat is generated from the chip, the heat sink and the chip end of the contact in time to absorb heat, and then transferred to the heat sink or other media, and finally the heat will be dispersed to the surrounding environment. Therefore, we do heat sink design should also start from these three aspects.

Heat absorption: depends on the heat sink and heat generator contact part of the heat absorbing plate effect, generally to conceal the full 4-point requirement: heat absorption fast, more heat storage, thermal resistance is small, go to the heat fast.

Measures:

1. Improve the flatness of the contact surface and contact area.

2. The specific heat capacity of the heat-absorbing plate should be high.

Commonly used design Cu Base , VC, etc..

Heat transfer: depends on the thermal diffusivity of the heat-conducting medium.

Commonly used design Heatpipe, VC, etc..

Heat dissipation: depends on the heat dissipation area and material properties, as well as fans and other factors.